Product Features

Using high-tech high-strength diamond as raw material and produced through special processing procedures, it has the characteristics of uniform and regular crystal form, multiple water chestnut, high surface finish, high strength, good thermal stability and high wear resistance. Due to the extremely strict control of large particles and particle length width ratio, the particle size distribution is concentrated and the effective grinding particles are concentrated.

  Product Applications

making wire saw, used for cutting / slicing monocrystalline silicon, polycrystalline silicon, sapphire, quartz sheet, semiconductor, liquid crystal glass, high-precision magnetic materials, etc.